RIEGL will be attending and exhibiting at Autodesk University 2018

7 November 2018

Autodesk University 2018 will take place from November 13-15, 2018 at the Venetian in Las Vegas, Nevada. RIEGL will be exhibiting at Booth #B823 during the conference. Meet the team of RIEGL experts during this conference to learn about the latest developments in RIEGL Waveform-LiDAR technology, how they work with Autodesk products, and how they can help you and your business.

RIEGL’s innovative laser scanning technology captures 3D LiDAR data that can be exported into Autodesk’s software such as AutoCAD, AutoCAD Civil 3D, and Revit. This allows Autodesk software users to utilize the 3D data for CAD work, civil engineering design, construction documentation, BIM modeling, planning, design, analysis and many other applications.

On display at the RIEGL booth throughout the week is the RIEGL VZ-400i ultra high performance 3D laser scanner available for live demonstrations. 

The VZ-400i is a cutting-edge 3D laser scanning system that combines future-oriented, innovative processing architecture and internet connectivity with RIEGL’s latest waveform processing LiDAR technology, redefining productivity.

RIEGL is looking forward to a successful conference and to welcoming you to Autodesk University 2018. 

Website RIEGL

Website Autodesk

 

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